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Golden Member
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引用:
https://www.reddit.com/r/LessCredib...y_published_an/
Huawei and Xihu University jointly published an SPIE paper on “Mandrel/spacer engineering-based
patterning and metallization incorporating metal layer division and rigorously self-aligned vias and cuts (SAVC)".
No need for EUV, use DUV and no need for multiple exposures, planning can be as low as 1nm
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DUV無須多重曝光就能做到1 nm
不知道真假
論文是論文
能不能量產? 
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