這篇文章改幾個數字，明後年某個時間點又可以重新上架，這文章重複在未來用個5,6次不成問題

大家都知道：蘋果、聯發科、超微產品換代的時候，都會更換製程，
如AMD今年換成7XXX系列，舊製程Zen3 使用的7nm當然大砍單，如果不把5nm增加的訂單拿出來做比對。真的只能說我現在就可以先把未來好幾篇新聞給寫出來

Apple、高通、聯發科的手機SOC確實是一直轉移到先進製程
但據傳也都有砍單，因為預估手機需求減緩

至於AMD的Zen4只能搭配DDR5，價位太高，不可能吸引中低階用戶
所以至今沒聽說Zen3已停產，既然如此，就不存在7nm產品全部停掉的問題
不過同樣因為PC需求疲軟，所以砍單是有可能的

比較例外的是PS5 SOC已經轉移到6nm，特意花錢轉移
推估應該是為了在同一塊晶圓上能切出更多晶片，好增加產能

不懂來發問

花錢轉移跟切出更多晶片, 哪個划得來?

P大 別鬧了
你跟這個天兵請教問題?
原本不太想管這天才了
真服了他還有臉在股票區鬼扯

今天真扯...原以為局面會是一面倒共和黨狂贏民主黨
該說選舉的慶祝行情要結束了嗎XD
依舊看空中

PS5漲價應該可以說明成本增加

但是產量增加的話，可以緩解缺貨問題

SONY應該是想優先解決缺貨問題

日月光回擊搶占高階封測的台積電！

《轉貼》"The semiconductor industry is trending towards chiplet-based architectures that rely on transformative packaging innovations to deliver critical power and performance requirements," commented Yin Chang, ASE’s Senior Vice President of Sales & Marketing. He continued, "As industry leader, ASE brings advanced packaging inclusion to the table by offering a broad portfolio of system integration technologies, including FOCoS-CF and FOCoS-CL, under our VIPack™ platform, geared towards enabling the world’s foremost applications such as HPC, artificial intelligence, 5G, and automotive."

"The magic of FOCoS-CF and FOCoS-CL is that we are able to optimize integration possibilities by scaling the electrical connectivity in fan-out to interconnect multiple different chips, simultaneously achieving both heterogeneous and homogeneous integration where chips are split up and combined within a fan-out package,’" said Dr. C.P. Hung, Vice President of R&D, ASE. He added, "This innovative technology approach is an industry first and provides considerable competitive advantage for our customers in meeting stringent miniaturization, bandwidth, latency, and other evolving design and performance requirements."

https://finance.yahoo.com/news/ase-...-150000095.html

果然空到了
現在是預期會有一個極短的反彈
所以是布局抄短線做多然後再等著空一波

感謝告知時程。